2023-02-24 08:41:40

Fast Axis Collimator (Blue FAC 300) for High Power Blue Diode Laser

Xi'an, China – [Feb, 24th, 2023]- Focuslight has announced the release of fast axis collimators for high power blue diode laser (Blue FAC 300). This new FAC has an effective focal length of 0.3mm, a plano-convex design, and is designed for fast axis collimation purposes for high power blue diode laser.

2023-01-17 11:03:01

The Rise of Micro-Optics Shows No Sign of Slowing

Micro-optics are a key enabler in the modern world, spurring advancements in consumer electronics, automotive lighting, and the next generation of autonomous vehicles. As demand grows from sectors far and wide, new fabrication approaches are allowing for faster and more economical production. With 30 years of micro-optical design experience—Focuslight’s wafer-based production technology produces polished wafers up to 300 x 300 mm², making it possible to produce tens of thousands of lenses in a two-step process with a consistently high level of quality. It is a scalable and cost-effective production technology for very high quantities, making it affordable for massive applications. 

2022-12-20 09:00:56

Silicon Optics with Large Sag

With this processing technology, the lens sag can achieve as large as 4 mm (4000 µm) at an exit angle of 0°~80° on silicon optics, which maximizes the numerical aperture (NA) that a silicon optics could achieve and exceeds the limit of the silicon optics processed with conventional technologies.

2022-10-11 09:33:20

SP17 & SP18 -- High-Power Diode Laser Side Pumped Modules

Focuslight Technologies Inc., a global photonics application solution provider, has announced the SP17 & SP18 high-power side pumped modules. The two models can offer peak power of 30kW and 5kW respectively while achieving higher small signal gain (SSG: >30 for SP18, >55 for SP17>55), and better fluorescence distribution uniformity >90%. SP17 & SP18 can be used for high-power solid-state laser pumping, and ultimately applied in advanced manufacturing fields such as material machining, surface treatment, and pan-semiconductor processing.