Beyond capturing flat images, 3D sensing technologies enable devices to perceive depth, adding a new dimension to imaging and interaction. Current mainstream approaches—such as binocular vision, structured light, and Time-of-Flight (ToF)—all rely heavily on high-precision micro-optical components to function effectively.
With over 30 years of expertise in Wafer-Level Optics (WLO) and wafer-level stacking, Heptagon delivers world-class optical designs and scalable manufacturing solutions. From dot and flood illuminators to direct ToF (dToF) modules, our technologies meet the demands of high-volume consumer applications, enabling compact, reliable, and high-performance 3D sensing systems.