AMC
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High Thermal Conductivity: AlN ceramic offers excellent thermal conductivity, providing efficient heat dissipation for laser chips.
High-Reliability Packaging: Pre-deposited AuSn thin film improves die bonding quality and ensures long-term operational reliability.
Thermal Expansion Matching: The thermal expansion coefficient closely matches materials such as Si and GaAs, effectively reducing thermal stress.
Widely used in high-power laser packaging and optical communications scenarios such as silicon photonics transceiver modules, ELSFP modules, CPO (co-packaged optics).