Focuslight Wins 2026 CFCF Annual Product Innovation Award

At the 11th China Fiber Connect Forum (CFCF 2026) held in Suzhou, China recently, Focuslight has been honored with the 2026 Annual Product Innovation Award in Passive Components, Materials and Parts. The award recognizes the company's Wafer-Level Simultaneously Structured V-Groove Technology for its outstanding innovation in precision micro-optics manufacturing, and highlights the growing importance of wafer-level manufacturing in enabling high-density optical interconnects and photonic packaging for the AI era.

Redefining Precision Manufacturing for High-Density Optical Packaging

As AI computing and hyperscale data centers continue to drive demand for higher bandwidth and greater integration, coupling accuracy and consistency in high-density fiber arrays have become critical challenges affecting both system performance and manufacturing scalability.

Built on a mature wafer-level manufacturing platform, Focuslight's Wafer-Level Simultaneously Structuring Technology enables all V-Grooves and alignment features to be fabricated simultaneously on a single wafer, eliminating cumulative tolerance errors associated with conventional groove-by-groove processing. Even for fiber arrays with 36, 40, or more channels, cumulative pitch error from the first to the last fiber remains below 500 nm.

The technology also supports the integration of complex geometries, including V- and U-grooves, concave and convex surfaces, and freeform structures, within a single component, providing a highly precise and efficient manufacturing solution for high-density V-groove arrays.

Building a Reliable Foundation for AI-Driven Optical Interconnects

Beyond its precision and design flexibility, the technology is compatible with a wide range of raw materials, including BF33 glass, fused silica, optical glass, and silicon, enabling optimized designs for diverse photonic packaging applications. It also supports automated assembly and scalable production of 96-channel and higher fiber arrays, providing a robust manufacturing platform for co-packaged optics (CPO), optical transceivers, low-loss PIC connectors, and other next-generation high-speed interconnect applications.

As AI infrastructure continues to accelerate the demand for higher-density optical connectivity, Focuslight remains committed to advancing precision micro-optics manufacturing through innovative wafer-level technologies. The company will continue to drive innovation in high-performance optical communications and photonic packaging, helping build the manufacturing foundation for the next generation of high-speed optical interconnects.