Job Description

1. Product definition:  Participate in the technical analysis of target markets and market and customer needs, evaluate and analyze product technical requirements and formulate a technical specification of the required product under the request of PLMPM Systematically position a product and come up with a product proposal with company existing capabilities or product platforms to support PLMPM for business decision.

2. Product development and management : Based on the product technical and business requirements, come up a product development technical objective, milestones and volume production plan. Lead the product development, testing and sample delivery, work closely with the MT&E team and production/manufacturing engineering to drive product design, development and pilot production, and manage product development progress and quality until have over to volume production. Only develop or engineer a product based on the company existing capabilities or product platforms.

3. Product pre - sales / after - sales technical support: Analyze customer needs through PLMPM and sales, conduct technical feasibility assessments, and provide customers with solutions and delivery plans based on the company existing capabilities or product platforms. If can not be solved, refer PLMPM to R&D. Directly participate in technical communication with customers when necessary, comprehensively and accurately understand customer needs, solve product/technical problems during the sales process, support the sales team in completing pre - sales work. Solve technical problems encountered by customers when using developed products to improve customer satisfaction before volume production. Once in standard production, goes through normal RMA and service process.

Job Qualification

1. Bacelor degree, mechnical / physics background, better in opto-electronics.

2. Slef moltivation, >3 years working experience in manufacturing related.

3. Better full time employee.

4. English speaking.

Purpose of Position Establishment

To develop, optimize, and sustain high-precision pick-and-place and reconstruction processes for glass optics modules and silicon dies used in advanced photonics and semiconductor packaging. This role ensures robust process integration, high yield, and alignment accuracy to meet stringent optical and electrical performance requirements for next-generation devices.

Job Responsibilities

1.Process Development and Optimization

1.1 Design and implement precision pick-and-place processes for glass optics and silicon dies using automated equipment (e.g., die bonders, flip-chip tools, vision systems).

1.2 Develop reconstruction processes including die reconstitution, wafer-level packaging, and optical alignment.

1.3 Design die sort methodologies including wafer mapping, binning strategies, and defect classification.

1.4 Evaluate and select adhesives, bonding materials, and curing profiles suitable for optical and semiconductor integration.

1.5 Conduct Design of Experiments (DOE) to optimize process parameters for yield, throughput, and reliability.

2.Equipment and Tooling

2.1 Specify and qualify equipment for pick-and-place and reconstruction operations.

2.2 Collaborate with equipment vendors to customize tooling and vision algorithms for sub-micron alignment.

2.3 Maintain and improve equipment uptime and process stability through preventive maintenance and troubleshooting.

3.Metrology and Quality Control

3.1 Define and implement metrology strategies for placement accuracy, tilt, coplanarity, and bonding quality.

3.2 Work with optical and electrical test teams to correlate process parameters with device performance.

3.3 Develop inspection criteria and control plans to ensure consistent quality across production lots.

4.Cross-Functional Collaboration

4.1 Work closely with optics design, packaging, and reliability teams to ensure process compatibility with product requirements.

4.2 Support new product introduction and transfer of processes from R&D to mass production.

4.3 Provide technical guidance to manufacturing and operations teams during ramp-up and sustaining phases.

5. Documentation and Reporting

5.1 Create and maintain detailed process documentation including SOPs, FMEAs, control plans, and work instructions.

5.2 Analyze process data and present findings to stakeholders for continuous improvement initiatives.

Qualifications

Basic Requirements

Bachelor’s or master’s degree in mechanical engineering, Materials Science, Optoelectronics, or related field.

Work Experience

1. 5+ years of hands-on experience in pick-and-place and reconstruction processes, preferably in optics or semiconductor packaging.

2. Proficiency in handling glass optics, silicon dies, and wafer-level packaging ,cutting process technologies.

Knowledge and Preferred Skills

1. Strong understanding of adhesive bonding, thermal curing, and alignment systems (Datacon, Mühlbauer).

2. Experience with statistical process control (SPC), DOE, and failure analysis.

3. Familiarity with cleanroom practices and wafer handling protocols.

4. Strong problem-solving and communication skills.

5. Proficiency in statistical analysis tools (e.g., JMP, Minitab) and process control methodologies.

Professional Qualities

Strong teamwork spirit, sense of responsibility, result-oriented mindset, and practical work ethic.

Purpose of Position Establishment

The Dicing Process Engineer plays a critical role in enabling high-yield, high-precision wafer singulation for advanced semiconductor and photonics products. This position is essential to the company’s mission of delivering cutting-edge microfabrication solutions by developing robust, scalable, and cost-effective dicing processes for glass and silicon substrates. The engineer will drive innovation in wafer-level processing, support new product introductions, and ensure manufacturing excellence through continuous process improvement.

Job Responsibilities

1.Process Development and Optimization

1.1 Develop and refine dicing processes for glass and silicon wafers using blade dicing, laser dicing, stealth dicing, or plasma dicing,die-attach, piece-to-substrate, piece-to-piece techniques.

1.2 Evaluate and select appropriate dicing methods based on wafer material, thickness, die size, and product requirements.

1.3 Design and execute DOE (Design of Experiments) to optimize dicing parameters such as spindle speed, feed rate, blade type, cooling methods, and laser settings.

1.4 Collaborate with cross-functional teams (R&D, packaging, quality, and equipment engineering) to integrate dicing processes into the overall manufacturing flow.

2.Equipment and Tooling

2.1 Specify, help install, and qualify dicing equipment (e.g., DISCO, ADT, or laser dicing systems).

2.2 Manage blade/tool selection and monitor tool wear and performance.

2.3 Troubleshoot equipment issues and implement corrective actions to minimize downtime and improve process stability.

3.Metrology and Characterization

3.1 Perform post-dicing inspection using optical microscopy, SEM, and surface profilometry to assess edge quality, chipping, kerf width, and die integrity.

3.2 Analyze dicing-induced damage and implement mitigation strategies.

3.3 Monitor and control particle contamination on wafer and wafer breakage rates.

4.Yield and Reliability

4.1 Drive yield improvement initiatives by identifying root causes of dicing-related defects and implementing process changes.

4.2 Support reliability testing and failure analysis related to dicing-induced stress or damage.

4.3 Maintain detailed documentation of process recipes, test results, and improvement actions.

5. Safety and Compliance

5.1 Ensure all dicing operations comply with safety standards and cleanroom protocols.

5.2 Maintain equipment and process documentation in accordance with ISO and internal quality systems.

Qualifications

Basic Requirements

Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or related field.

Work Experience

1.Minimum 5 years of hands-on experience in wafer dicing process development, preferably in semiconductor or photonics industries.

2. Proven track record of developing and scaling dicing processes for glass and silicon wafers.

Knowledge and Skills

1. Deep understanding of wafer materials, mechanical properties, and dicing-induced stress.

2. Proficient in common tools such as IE, SPC, PFMEA, CP, MSA, and NPI.

3. Familiarity with cleanroom practices and wafer handling protocols.

4. Strong problem-solving and communication skills.

Professional Qualities

Strong teamwork spirit, sense of responsibility, results-oriented mindset, and practical work ethic.

 Purpose of Position Establishment

The Manufacturing Engineer is responsible for developing, implementing, and optimizing manufacturing processes to ensure efficient production, high quality, and cost-effectiveness. This role involves close collaboration with production, quality, and design teams to support product introduction, continuous improvement, and scaling to high-volume manufacturing.

Job Responsibilities

1.Process Development and Optimization

1.1 Design, implement, and improve manufacturing processes to enhance efficiency and reduce cost.

1.2 Develop and validate work instructions, process flow charts, and standard operating procedures (SOPs).

1.3 Perform time studies, capacity analysis, and line balancing.

2.Production Support

2.1 Provide daily engineering support to resolve production issues, equipment downtime, and process bottlenecks.

2.2 Drive root cause analysis and corrective/preventive actions (CAPA) for quality and yield problems.

2.3 Ensure processes comply with safety and quality standards (ISO, IATF).

3.New Product Introduction (NPI)

3.1 Collaborate with R&D and design teams to transition products from prototype to mass production.

3.2 Develop process validation plans (IQ, OQ, PQ) and oversee qualification builds.

3.3 Optimize tooling, fixtures, and equipment to meet production requirements.

4.Continuous Improvement

4.1 Apply Lean Manufacturing, Six Sigma, and other improvement methodologies to eliminate waste and improve throughput.

4.2 Identify opportunities for automation and digitalization in manufacturing.

4.3 Monitor and analyze key performance indicators (OEE, yield, scrap, cycle time).

5. Collaboration and Documentation

5.1 Work with suppliers, quality, and supply chain teams to ensure material readiness and compliance.

5.2 Prepare technical documentation, reports, and training for operators and technicians.

5.3 Support audits, compliance checks, and certification activities.

Qualifications

Basic Requirements

Bachelor’s degree in mechanical engineering, Industrial Engineering, Manufacturing Engineering, or related field.

Work Experience

1. Experience in a manufacturing or production engineering environment.

2. Certification in Lean Six Sigma (Green/Black Belt) or PMP is a plus.

Knowledge and Preferred Skills

1. Knowledge of Lean, Six Sigma, SPC, PFMEA, and root cause analysis tools.

2. Strong analytical, problem-solving, and communication skills.

3. Familiarity with ERP/MES, SPC systems.

4. Use JMP on data analysis and Statistical Process Control.

5. Python (or other programming language) skills are highly advantageous for data analysis and automation.

Professional Qualities

Strong teamwork spirit, sense of responsibility, result-oriented mindset, and practical work ethic.

Duties

• Comprehensive HR Exposure – Involve in end-to-end HR functions including recruitment, onboarding/offboarding, leave & benefits administration, and employee engagement.
• Training & Development – Coordinate and support staff training initiatives to foster continuous learning and growth.
• HR Operations & Compliance – Manage work pass processes, HR systems, MSF Government-Paid Leave, NS-Pay claim and ensure compliance with relevant regulations.
• Employee Support – Act as a key contact for employee queries and provide responsive, people-first HR service.
• Office & Admin Management – Oversee general office operations including inventory, pantry, lease, equipment maintenance, and document control.
• Vendor Coordination – Liaise with vendors to ensure the operations runs smoothly.

Requirements

• Prior HR and Office administration experience preferred.
• Diploma in Human Resource Management, Business Administration, or related field.
• Proficient in MS Office and Excel.

Key Responsibilities

• Lead and manage the Quality Control team to ensure product and process compliance with
internal standards and regulatory requirements.
• Oversee the handling and resolution of internal and external non-conformities, ensuring timely and effective corrective actions.
• Define, implement, and monitor Corrective and Preventive Actions (CAPA) for long-term
effectiveness.
• Drive root cause analysis (RCA) using tools such as 8D, Ishikawa, and 5 Whys, and ensure
implementation of robust solutions.
• Review and approve qualification protocols and reports (IQ, OQ, PQ) for equipment, processes, and systems.
• Ensure full compliance with ISO 9001 and other relevant quality standards; coordinate internal and external audits and ensure documentation readiness.
• Manage risk assessments and implement mitigation strategies in collaboration with production and technical teams.
• Utilize statistical methods to monitor and improve product and process performance (Cp, Cpk, SPC, trend analysis).
• Promote the use of quality tools (FMEA, DOE, Control Charts) to support continuous
improvement initiatives.
• Collaborate closely with production, R&D, maintenance, and engineering departments to identify and implement process enhancements.
• Oversee training of teams on Good Manufacturing Practices (GMP), good documentation
practices, and regulatory requirements.
• Maintain and continuously improve quality documentation, including SOPs, work instructions, inspection protocols, and reports.

Your Profile

• Engineering degree (HES or EPF) with strong analytical and data interpretation skills.
• At least 5 years' experience in a similar position, preferably in the micro-technology or
electronics industry with proven managerial responsibilities.
• Solid expertise in quality tools and methodologies: FMEA, Six Sigma, SPC, etc.
• Strong leadership, excellent communication skills, proactive, organized and solution-oriented mindset.
• Fluent in English, both written and spoken. French fluency is an asset.
• Knowledge of semiconductor processes and thin-film technologies is a strong asset.

We Offer

• A dynamic working environment.
• A multicultural company culture.
• Positive working atmosphere in a motivated team.
• A key role in driving quality performance and continuous improvement across the organization.