Focuslight has launched
AuSn deposited AlN substrates (FL-AMC series) and
AuSn deposition technical service recently.
AuSn thin film is a critical technology to enable optoelectronic device to ensure durability, anti-oxidation ability and reliability compared with Indium, SnPb and SnBi etc..
AuSn is widely used in optoelectronic chip bonding, housing assembling, and lens assembling applications. AuSn can be pre-deposited on various substrate materials, such as AlN, CuW, SiC, glass, CVD Diamond, and Copper Diamond (CuD) for different applications.
Focuslight is one of the technical pioneers in AuSn thin film deposition and AuSn bonding process with more than ten years of experience, also becomes a reliable supplier of AuSn pre-deposited AlN substrates and AuSn deposition technical service.
By using physical vapor deposition technology, the thickness of AuSn is less than 10μm with tolerance of +/-1μm, and thickness uniformity can reach 3%, which is critical for increasing the uniformity of bonding interface, reducing the void rate of bonding interface, and increasing the output power of device finally.
The parameters of the standard FL-AMC products are as below:
Product Fearures:
1. Low thermal resistance
With solid experiences in chip bonding application, Focuslight optimized the thermal management design of all layers of substrate materials to achieve low thermal resistance chip bonding application and ensure the high reliability of devices.
Figure 1 Bonding 25W chip with Focuslight FL-AMC products, test the limit thermal rollover power under 40A
2. Low stress design
Focuslight optimized the thickness design and CTE matching design of each material layer during development, to get CTE matching effect between chip and substrate, to achieve low-stress chip bonding and significantly increasing reliability of the device.
Figure 2 Bonding 25W chip with Focuslight FL-AMC products, test the lifetime under 25A
Figure 3 The lifetime test of Focuslight HCS02-80W device use self-made AuSn technology has reached more than 26,000 hours
3. High-quality AuSn deposition technology
Focuslight established strict quality management system in PVD process to produce quality AuSn thin film on base material to ensure reliability and consistency in mass production.
4. High volume manufacturing capacity
To fully meet high-volume optoelectronic device packaging market demand. Focuslight developed ” From wafer processing to single unit” production mode, greatly improved the product consistency and production efficiency.
In addition, Focuslight is able to support customers on high power chip bonding and testing with fast response, as well as customized product and technical service.
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