Core Technologies

Diode Laser

Eutectic Bonding

Thermal Management

Thermal Stress Control

Interface Materials and Surface Engineer

Test Analysis and Diagnosis

Hard solder & totally Indium-free die bonding process, which effectively prevents the creep, electeromigration and thermal fatigue of indium solder, has been applied to all kind of high power diode lasers based on the CTE matched substrate with high thermal conductivity to enhance its lifetime and reliability.
Optimizing design in packaging structure and using advanced materiel with high thermal conductivity, effectively improve the ability of heat dissipation to ensure a higher output power of CW 200W & QCW 750W per bar.
Theoretically study and analyze the mechanism of thermal stress on the performance of high power diode lasers. Advanced thermal management technology which can lower and homogenize the thermal stress, has been developed to improve the device performance, such as lower smile, higher DoP and narrow spectrum.
Develop the specific technology of surface treatment process to enhance the characteristics of surface state of bonding materials for the increase of adhesive strength and long-time reliability of die bonding. Thin film Gold-tin eutectic solder has been developed in house, whose composition can easily to be adjusted for fulfilling the stable and reliable indium-free die bonding.
The performance stability mechanism of high-power diode lasers is improved, and develop the preparation technology of response which greatly improves the reliability and stability.

Micro Optics

Beam Transformation System (BTS)
Compact Beam Shaper
Wafer level laser optics manufacturing technology
The BTS transforms the asymmetrical far field distribution of a diode laser bar into a nearly symmetrical beam parameter product. A symmetrical focus can be generated by an
LIMO homogenizers can produce many different beam shapes making it extremely versatile in use.
LIMO's process head Compact Beam Shaper (CBS) has a compact design and uses integrated high-grade micro-optics to generate line-shaped or square laser beams
Based on the wafer-level synchronous structured laser optics manufacturing technology to produce 12-inch (300mm×300mm) glass micro-optics wafers, with nano-level precision refractive microlens array (ROE) technical capabilities, it can meet different application requirements.




As of Sep. 30, 2020, Focuslight has obtained a total of 300 patents in China, including 117 invention patents, 155 utility model patents
and 28 design patents, as well as 107 patents outside China.


As of Sep. 30, 2020, Focuslight has obtained a total of 251 registered trademarks in China and 22 registered trademarks outside China.

National Standards


Focuslight led the establishment of two national standards, providing technical reference and guidance for the production and use of semiconductor lasers.



Focuslight CEO Dr. Victor Liu co-authored the technical book titled “Packaging of High Power Semiconductor Lasers” published by Springer in 2015.